p r oduct details dimension a dimension b dimension c dimension d inter f ace m a terial finish n o tes: d imension c = heat sink height from bottom of the base to the top of the ?n ?eld. a ts-59008-c1-r0 is a subsitute item available utilizing an equivalent phase change material (chomerics t766). thermal performance data are provided for reference onl y . actual performance may vary by application. a ts reserves the right to update or change its products without notice to improve th e design or performance. contact a ts to learn about custom options available. 1) 2) 3) 4) 5) t he r mal p er f o r mance f or mo r e in f o r m a tion, to ?nd a distributor or to place an o r de r , visit ww w .q a ts.com or call: 781.769.2800 (no r th america); +31 (0) 3569 84715 (eu r ope). a ts p art # a ts-59008-c2-r0 f e a tu r es & bene?ts custom high p er f o r mance cooling solutions w/ maxigrip? atta c hment rev2_111408 a ir v elocit y t hermal r esis t ance ft/min m/s c/w (unducted flow) c/w (ducted flow) 200 1.0 300 1.5 400 2.0 500 2.5 600 3.0 700 3.5 800 4.0 2.42 1.98 1.7 1.53 1.4 1.3 1.2 1.6 35 mm 46 mm 16 mm 57.8 mm black-anodized s aint - gobain c 1 100f designed for flip-chip processors such as freescale mpcs maxigrip? attachment applies stead y , even pressure to the component and does not require holes in the pcb comes preassembled with high performance, phase changing, thermal interface material ? ? ? c a b d *image above is for illustration purposes onl y .
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